Step1: Product
Toshiba Semiconductor and Storage MG400Q2YMS3(DAE)
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Manufacturer
Manufacturer No
MG400Q2YMS3(DAE)
Package
Module
Packaging
Tray
Description
SIC MOSFET MODULE, 1200V, 400A
Detailed Description
Mosfet Array 1700V (1.7kV) 250A (Tc) 1350W (Tc) Chassis Mount
DataSheet
Packaging
Tray
Technology
Silicon Carbide (SiC)
Part Status
Active
Power - Max
1350W (Tc)
Manufacturer
Toshiba Semiconductor and Storage
Configuration
2 N-Channel (Half Bridge)
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
5.6V @ 400mA
Operating Temperature
150°C
Drain to Source Voltage (Vdss)
1700V (1.7kV)
Input Capacitance (Ciss) (Max) @ Vds
36000pF @ 900V
Current - Continuous Drain (Id) @ 25°C
250A (Tc)
| Attribute | Value |
|---|---|
| Packaging | Tray |
| Technology | Silicon Carbide (SiC) |
| Part Status | Active |
| Power - Max | 1350W (Tc) |
| Manufacturer | Toshiba Semiconductor and Storage |
| Configuration | 2 N-Channel (Half Bridge) |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Vgs(th) (Max) @ Id | 5.6V @ 400mA |
| Operating Temperature | 150°C |
| Drain to Source Voltage (Vdss) | 1700V (1.7kV) |
| Input Capacitance (Ciss) (Max) @ Vds | 36000pF @ 900V |
| Current - Continuous Drain (Id) @ 25°C | 250A (Tc) |
Purchase & Inquiry
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IMPORTANT NOTICE
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2.Since inventories and prices may fuctuate to some extent, the sales manager is going to reconfirm the order and let you know
Packing
Step2: Vacuum Packaging
Step3: Anti-StaticBag
Step4: Individual Packaging
Step5: Packaging Boxes
Shipping Information
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 | DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time: Shipping fees vary depending on the destination region and country.
