NXP USA Inc. NX3L4684TK,115

NXP USA Inc. NX3L4684TK,115 electronic component

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Manufacturer
Manufacturer No
NX3L4684TK,115
Package
10-VFDFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC SWITCH SPDTX2 750MOHM 10HVSON
Detailed Description
2 Circuit IC Switch 2:1 750mOhm 10-HVSON (3x3)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Crosstalk
-90dB @ 100kHz
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
20MHz
Package / Case
10-VFDFN Exposed Pad
Switch Circuit
SPDT
Charge Injection
50pC
Number of Circuits
2
Base Product Number
NX3L4684
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
10-HVSON (3x3)
On-State Resistance (Max)
750mOhm
Switch Time (Ton, Toff) (Max)
45ns, 20ns
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)
10nA
Multiplexer/Demultiplexer Circuit
2:1
Channel-to-Channel Matching (ΔRon)
40mOhm
Channel Capacitance (CS(off), CD(off))
35pF
AttributeValue
Crosstalk-90dB @ 100kHz
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth20MHz
Package / Case10-VFDFN Exposed Pad
Switch CircuitSPDT
Charge Injection50pC
Number of Circuits2
Base Product NumberNX3L4684
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package10-HVSON (3x3)
On-State Resistance (Max)750mOhm
Switch Time (Ton, Toff) (Max)45ns, 20ns
Voltage - Supply, Single (V+)1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)10nA
Multiplexer/Demultiplexer Circuit2:1
Channel-to-Channel Matching (ΔRon)40mOhm
Channel Capacitance (CS(off), CD(off))35pF

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Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
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