NXP USA Inc. NX3L4684GM,132

NXP USA Inc. NX3L4684GM,132 electronic component

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Manufacturer
Manufacturer No
NX3L4684GM,132
Package
10-XFQFN
Packaging
Tape & Reel (TR)
Description
IC SWITCH SPDTX2 750MOHM 10XQFN
Detailed Description
2 Circuit IC Switch 2:1 750mOhm 10-XQFN (1.55x2)
DataSheet
Crosstalk
-90dB @ 100kHz
Packaging
Tape & Reel (TR)
Part Status
Obsolete
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
20MHz
Package / Case
10-XFQFN
Switch Circuit
SPDT
Charge Injection
50pC
Number of Circuits
2
Base Product Number
NX3
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
10-XQFN (1.55x2)
On-State Resistance (Max)
750mOhm
Switch Time (Ton, Toff) (Max)
45ns, 20ns
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)
10nA
Multiplexer/Demultiplexer Circuit
2:1
Channel-to-Channel Matching (ΔRon)
40mOhm
Channel Capacitance (CS(off), CD(off))
35pF
AttributeValue
Crosstalk-90dB @ 100kHz
PackagingTape & Reel (TR)
Part StatusObsolete
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth20MHz
Package / Case10-XFQFN
Switch CircuitSPDT
Charge Injection50pC
Number of Circuits2
Base Product NumberNX3
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package10-XQFN (1.55x2)
On-State Resistance (Max)750mOhm
Switch Time (Ton, Toff) (Max)45ns, 20ns
Voltage - Supply, Single (V+)1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)10nA
Multiplexer/Demultiplexer Circuit2:1
Channel-to-Channel Matching (ΔRon)40mOhm
Channel Capacitance (CS(off), CD(off))35pF

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