NXP USA Inc. NX3DV3899HRZ

NXP USA Inc. NX3DV3899HRZ electronic component

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Manufacturer
Manufacturer No
NX3DV3899HRZ
Quantity
50
Availability
In Stock
Package
16-XFQFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC SWITCH DPDTX2 3.3OHM 16HXQFN
Detailed Description
2 Circuit IC Switch 2:2 3.3Ohm 16-HXQFN (3x3)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Grade
Automotive
Crosstalk
-90dB @ 1MHz
Packaging
Tape & Reel (TR)
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Qualification
AEC-Q100
-3db Bandwidth
200MHz
Package / Case
16-XFQFN Exposed Pad
Switch Circuit
DPDT
Charge Injection
4pC
Number of Circuits
2
Base Product Number
NX3DV3899
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
16-HXQFN (3x3)
On-State Resistance (Max)
3.3Ohm
Switch Time (Ton, Toff) (Max)
40ns, 20ns
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)
5nA
Multiplexer/Demultiplexer Circuit
2:2
Channel-to-Channel Matching (ΔRon)
700mOhm
Channel Capacitance (CS(off), CD(off))
8pF
AttributeValue
GradeAutomotive
Crosstalk-90dB @ 1MHz
PackagingTape & Reel (TR)
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
QualificationAEC-Q100
-3db Bandwidth200MHz
Package / Case16-XFQFN Exposed Pad
Switch CircuitDPDT
Charge Injection4pC
Number of Circuits2
Base Product NumberNX3DV3899
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package16-HXQFN (3x3)
On-State Resistance (Max)3.3Ohm
Switch Time (Ton, Toff) (Max)40ns, 20ns
Voltage - Supply, Single (V+)1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)5nA
Multiplexer/Demultiplexer Circuit2:2
Channel-to-Channel Matching (ΔRon)700mOhm
Channel Capacitance (CS(off), CD(off))8pF

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Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
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