NXP USA Inc. NX3DV2567HR,115

NXP USA Inc. NX3DV2567HR,115 electronic component

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Manufacturer
Manufacturer No
NX3DV2567HR,115
Quantity
5
Availability
In Stock
Package
16-XFQFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC ANLG SWITCH 4PDT 16HXQFN
Detailed Description
Networking Switch IC 1 Channel 16-HXQFN (3x3)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Packaging
Tape & Reel (TR); Cut Tape (CT)
Applications
Networking
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
160MHz
Package / Case
16-XFQFN Exposed Pad
Switch Circuit
4PDT
Number of Channels
1
Base Product Number
NX3DV2567
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
16-HXQFN (3x3)
On-State Resistance (Max)
700mOhm
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
AttributeValue
PackagingTape & Reel (TR); Cut Tape (CT)
ApplicationsNetworking
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth160MHz
Package / Case16-XFQFN Exposed Pad
Switch Circuit4PDT
Number of Channels1
Base Product NumberNX3DV2567
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package16-HXQFN (3x3)
On-State Resistance (Max)700mOhm
Voltage - Supply, Single (V+)1.4V ~ 4.3V

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

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