NXP USA Inc. NX3DV642GU,115

NXP USA Inc. NX3DV642GU,115 electronic component

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Manufacturer
Manufacturer No
NX3DV642GU,115
Quantity
50
Availability
In Stock
Package
24-XFQFN
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC SWITCH TPDT DIFF XQFN24
Detailed Description
MIPI Switch IC 1 Channel 24-XQFN (2.5x3.4)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Features
Break-Before-Make
Packaging
Tape & Reel (TR); Cut Tape (CT)
Applications
MIPI
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
950MHz
Package / Case
24-XFQFN
Switch Circuit
3PDT
Number of Channels
1
Base Product Number
NX3DV642
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
24-XQFN (2.5x3.4)
On-State Resistance (Max)
14Ohm
Voltage - Supply, Single (V+)
2.65V ~ 4.3V
AttributeValue
FeaturesBreak-Before-Make
PackagingTape & Reel (TR); Cut Tape (CT)
ApplicationsMIPI
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth950MHz
Package / Case24-XFQFN
Switch Circuit3PDT
Number of Channels1
Base Product NumberNX3DV642
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package24-XQFN (2.5x3.4)
On-State Resistance (Max)14Ohm
Voltage - Supply, Single (V+)2.65V ~ 4.3V

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Payment Method

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

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