NXP USA Inc. NX3DV642GU,115

NXP USA Inc. NX3DV642GU,115 electronic component

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Manufacturer
Manufacturer No
NX3DV642GU,115
Quantity
50
Availability
In Stock
Package
24-XFQFN
Packaging
Tape & Reel (TR); Cut Tape (CT);
Description
IC SWITCH TPDT DIFF XQFN24
Detailed Description
MIPI Switch IC 1 Channel 24-XQFN (2.5x3.4)
DataSheet
Features
Break-Before-Make
Packaging
Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part Status
Obsolete
Applications
MIPI
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
950MHz
Package / Case
24-XFQFN
Switch Circuit
3PDT
Number of Channels
1
Base Product Number
NX3DV642
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
24-XQFN (2.5x3.4)
On-State Resistance (Max)
14Ohm
Voltage - Supply, Single (V+)
2.65V ~ 4.3V
AttributeValue
FeaturesBreak-Before-Make
PackagingTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part StatusObsolete
ApplicationsMIPI
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth950MHz
Package / Case24-XFQFN
Switch Circuit3PDT
Number of Channels1
Base Product NumberNX3DV642
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package24-XQFN (2.5x3.4)
On-State Resistance (Max)14Ohm
Voltage - Supply, Single (V+)2.65V ~ 4.3V

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Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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