NXP USA Inc. NX3V1G66GM,115

NXP USA Inc. NX3V1G66GM,115 electronic component

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Manufacturer
Manufacturer No
NX3V1G66GM,115
Package
6-XFDFN
Packaging
Tape & Reel (TR)
Description
IC SW SPST-NOX1 450MOHM 6XSON
Detailed Description
1 Circuit IC Switch 1:1 450mOhm 6-XSON, SOT886 (1.45x1)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Packaging
Tape & Reel (TR)
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
-3db Bandwidth
25MHz
Package / Case
6-XFDFN
Switch Circuit
SPST - NO
Charge Injection
12pC
Number of Circuits
1
Base Product Number
NX3
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
6-XSON, SOT886 (1.45x1)
On-State Resistance (Max)
450mOhm
Switch Time (Ton, Toff) (Max)
24ns, 9ns
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)
10nA
Multiplexer/Demultiplexer Circuit
1:1
Channel Capacitance (CS(off), CD(off))
70pF
AttributeValue
PackagingTape & Reel (TR)
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
-3db Bandwidth25MHz
Package / Case6-XFDFN
Switch CircuitSPST - NO
Charge Injection12pC
Number of Circuits1
Base Product NumberNX3
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package6-XSON, SOT886 (1.45x1)
On-State Resistance (Max)450mOhm
Switch Time (Ton, Toff) (Max)24ns, 9ns
Voltage - Supply, Single (V+)1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)10nA
Multiplexer/Demultiplexer Circuit1:1
Channel Capacitance (CS(off), CD(off))70pF

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Shipped from
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Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
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