Micron Technology Inc. MT62F1G32D2DS-023 WT:C

Micron Technology Inc. MT62F1G32D2DS-023 WT:C electronic component

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Manufacturer No
MT62F1G32D2DS-023 WT:C
Quantity
79,811
Availability
In Stock
Package
315-TFBGA
Packaging
Box
Description
IC DRAM 32GBIT PAR 315TFBGA
Detailed Description
SDRAM - Mobile LPDDR5 Memory IC 32Gbit Parallel 3.2 GHz 315-TFBGA (12.4x15)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Micron Technology Inc.
Packaging
Box
Technology
SDRAM - Mobile LPDDR5
Memory Size
32Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Package / Case
315-TFBGA
Clock Frequency
3.2 GHz
Memory Interface
Parallel
Voltage - Supply
1.05V
Base Product Number
MT62F1G32
Memory Organization
1G x 32
DigiKey Programmable
Not Verified
Operating Temperature
-25°C ~ 85°C
Supplier Device Package
315-TFBGA (12.4x15)
AttributeValue
MfrMicron Technology Inc.
PackagingBox
TechnologySDRAM - Mobile LPDDR5
Memory Size32Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
Package / Case315-TFBGA
Clock Frequency3.2 GHz
Memory InterfaceParallel
Voltage - Supply1.05V
Base Product NumberMT62F1G32
Memory Organization1G x 32
DigiKey ProgrammableNot Verified
Operating Temperature-25°C ~ 85°C
Supplier Device Package315-TFBGA (12.4x15)

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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