Micron Technology Inc. MT62F768M32D2DS-023 AIT:B

Micron Technology Inc. MT62F768M32D2DS-023 AIT:B electronic component

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Manufacturer No
MT62F768M32D2DS-023 AIT:B
Quantity
79,842
Availability
In Stock
Package
315-TFBGA
Packaging
Tray
Description
IC DRAM 24GBIT LVSTL 315TFBGA
Detailed Description
SDRAM - Mobile LPDDR5X Memory IC 24Gbit LVSTL 4.266 GHz 315-TFBGA (12.4x15)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Micron Technology Inc.
Grade
Automotive
Packaging
Tray
Technology
SDRAM - Mobile LPDDR5X
Memory Size
24Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
315-TFBGA
Clock Frequency
4.266 GHz
Memory Interface
LVSTL
Voltage - Supply
1.01V ~ 1.12V
Base Product Number
MT62F768
Memory Organization
768M x 32
Operating Temperature
-40°C ~ 95°C (TC)
Supplier Device Package
315-TFBGA (12.4x15)
AttributeValue
MfrMicron Technology Inc.
GradeAutomotive
PackagingTray
TechnologySDRAM - Mobile LPDDR5X
Memory Size24Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case315-TFBGA
Clock Frequency4.266 GHz
Memory InterfaceLVSTL
Voltage - Supply1.01V ~ 1.12V
Base Product NumberMT62F768
Memory Organization768M x 32
Operating Temperature-40°C ~ 95°C (TC)
Supplier Device Package315-TFBGA (12.4x15)

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Payment Method

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

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Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

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Packaging box with shipping label

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