Micron Technology Inc. MT53E1G64D4HJ-046 AUT:C TR

Micron Technology Inc. MT53E1G64D4HJ-046 AUT:C TR electronic component

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Manufacturer No
MT53E1G64D4HJ-046 AUT:C TR
Quantity
79,985
Availability
In Stock
Package
556-TFBGA
Packaging
Tape & Reel (TR)
Description
IC DRAM 64GBIT PAR 556WFBGA
Detailed Description
SDRAM - Mobile LPDDR4X Memory IC 64Gbit Parallel 2.133 GHz 3.5 ns 556-WFBGA (12.4x12.4)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Micron Technology Inc.
Grade
Automotive
Packaging
Tape & Reel (TR)
Technology
SDRAM - Mobile LPDDR4X
Access Time
3.5 ns
Memory Size
64Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
556-TFBGA
Clock Frequency
2.133 GHz
Memory Interface
Parallel
Voltage - Supply
1.06V ~ 1.17V
Base Product Number
MT53E1G64
Memory Organization
1G x 64
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 125°C (TC)
Supplier Device Package
556-WFBGA (12.4x12.4)
Write Cycle Time - Word, Page
18ns
AttributeValue
MfrMicron Technology Inc.
GradeAutomotive
PackagingTape & Reel (TR)
TechnologySDRAM - Mobile LPDDR4X
Access Time3.5 ns
Memory Size64Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case556-TFBGA
Clock Frequency2.133 GHz
Memory InterfaceParallel
Voltage - Supply1.06V ~ 1.17V
Base Product NumberMT53E1G64
Memory Organization1G x 64
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 125°C (TC)
Supplier Device Package556-WFBGA (12.4x12.4)
Write Cycle Time - Word, Page18ns

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Payment Method

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

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