Micron Technology Inc. MT53E768M32D2ZW-046 AUT:C

Micron Technology Inc. MT53E768M32D2ZW-046 AUT:C electronic component

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Manufacturer No
MT53E768M32D2ZW-046 AUT:C
Quantity
79959
Availability
In Stock
Package
200-TFBGA
Packaging
Tray
Description
IC DRAM 24GBIT 200TFBGA
Detailed Description
SDRAM - Mobile LPDDR4X Memory IC 24Gbit LVSTL 2.133 GHz 3.5 ns 200-TFBGA (10x14.5)
Mfr
Micron Technology Inc.
Grade
Automotive
Packaging
Tray
Technology
SDRAM - Mobile LPDDR4X
Access Time
3.5 ns
Memory Size
24Gbit
Memory Type
Volatile
Part Status
Last Time Buy
Memory Format
DRAM
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
200-TFBGA
Clock Frequency
2.133 GHz
Memory Interface
LVSTL
Voltage - Supply
1.06V ~ 1.17V
Base Product Number
MT53E768
Memory Organization
768M x 32
Operating Temperature
-40°C ~ 125°C (TC)
Supplier Device Package
200-TFBGA (10x14.5)
Write Cycle Time - Word, Page
18ns
AttributeValue
MfrMicron Technology Inc.
GradeAutomotive
PackagingTray
TechnologySDRAM - Mobile LPDDR4X
Access Time3.5 ns
Memory Size24Gbit
Memory TypeVolatile
Part StatusLast Time Buy
Memory FormatDRAM
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case200-TFBGA
Clock Frequency2.133 GHz
Memory InterfaceLVSTL
Voltage - Supply1.06V ~ 1.17V
Base Product NumberMT53E768
Memory Organization768M x 32
Operating Temperature-40°C ~ 125°C (TC)
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.