NXP USA Inc. MM908E624ACDWB

NXP USA Inc. MM908E624ACDWB electronic component

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Manufacturer
Manufacturer No
MM908E624ACDWB
Package
54-BSSOP (0.295", 7.50mm Width)
Packaging
Tube
Description
IC TRPL SWITCH MCU/LIN 54-SOIC
Detailed Description
HC08 - Mirror Control Microcontroller IC FLASH (16kB) 54-BSSOP (0.295", 7.50mm Width)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Grade
Automotive
RAM Size
512 x 8
Interface
SCI, SPI
Packaging
Tube
Applications
Mirror Control
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Number of I/O
16
Core Processor
HC08
Package / Case
54-BSSOP (0.295", 7.50mm Width)
Voltage - Supply
5.5V ~ 18V
Controller Series
908E
Base Product Number
MM908
Program Memory Type
FLASH (16kB)
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
54-SOIC
AttributeValue
GradeAutomotive
RAM Size512 x 8
InterfaceSCI, SPI
PackagingTube
ApplicationsMirror Control
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Number of I/O16
Core ProcessorHC08
Package / Case54-BSSOP (0.295", 7.50mm Width)
Voltage - Supply5.5V ~ 18V
Controller Series908E
Base Product NumberMM908
Program Memory TypeFLASH (16kB)
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 85°C
Supplier Device Package54-SOIC

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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