NXP USA Inc. MM912I637AV1EP-NXP

NXP USA Inc. MM912I637AV1EP-NXP electronic component

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Manufacturer
Manufacturer No
MM912I637AV1EP-NXP
Package
48-VFQFN Exposed Pad
Packaging
Bulk
Description
BATTERY SENSOR, LIN, 96KB FLASH,
Detailed Description
HCS12 S12 Microcontroller IC FLASH (48kB) 48-VFQFN Exposed Pad
DataSheet
Grade
Automotive
Series
S12
RAM Size
6K x 8
Interface
LIN, PWM, SCI, SPI
Packaging
Bulk
Part Status
Active
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Number of I/O
14
Core Processor
HCS12
Package / Case
48-VFQFN Exposed Pad
Voltage - Supply
2.25V ~ 5.25V
Controller Series
HCS12
Program Memory Type
FLASH (48kB)
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
48-QFN-EP (7x7)
AttributeValue
GradeAutomotive
SeriesS12
RAM Size6K x 8
InterfaceLIN, PWM, SCI, SPI
PackagingBulk
Part StatusActive
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Number of I/O14
Core ProcessorHCS12
Package / Case48-VFQFN Exposed Pad
Voltage - Supply2.25V ~ 5.25V
Controller SeriesHCS12
Program Memory TypeFLASH (48kB)
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package48-QFN-EP (7x7)

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Packing

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Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
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Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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