NXP USA Inc. MC33FS6502LAE

NXP USA Inc. MC33FS6502LAE electronic component

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Manufacturer
Manufacturer No
MC33FS6502LAE
Quantity
10
Availability
In Stock
Package
48-LQFP Exposed Pad
Packaging
Tray
Description
SYSTEM BASIS CHIP DCDC 0.8A VCO
Detailed Description
System Basis Chip PMIC 48-HLQFP (7x7)
DataSheet
Packaging
Tray
Part Status
Active
Applications
System Basis Chip
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Package / Case
48-LQFP Exposed Pad
Voltage - Supply
1V ~ 5V
Base Product Number
MC33FS6502
Operating Temperature
-40°C ~ 125°C
Supplier Device Package
48-HLQFP (7x7)
AttributeValue
PackagingTray
Part StatusActive
ApplicationsSystem Basis Chip
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Package / Case48-LQFP Exposed Pad
Voltage - Supply1V ~ 5V
Base Product NumberMC33FS6502
Operating Temperature-40°C ~ 125°C
Supplier Device Package48-HLQFP (7x7)

Purchase & Inquiry

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.