NXP USA Inc. MC33FS8415GJES

NXP USA Inc. MC33FS8415GJES electronic component

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Manufacturer
Manufacturer No
MC33FS8415GJES
Quantity
10
Availability
In Stock
Package
56-VFQFN Exposed Pad
Packaging
Tray
Description
SAFETY POWER MANAGEMENT IC, QFN5
Detailed Description
System Basis Chip PMIC 56-HVQFN (8x8)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Grade
Automotive
Packaging
Tray
Applications
System Basis Chip
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount, Wettable Flank
Qualification
AEC-Q100
Package / Case
56-VFQFN Exposed Pad
Current - Supply
15mA
Voltage - Supply
60V
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
56-HVQFN (8x8)
AttributeValue
GradeAutomotive
PackagingTray
ApplicationsSystem Basis Chip
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount, Wettable Flank
QualificationAEC-Q100
Package / Case56-VFQFN Exposed Pad
Current - Supply15mA
Voltage - Supply60V
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package56-HVQFN (8x8)

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

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Product in anti-static bag

Step2: Anti StaticBag

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Packaging box with shipping label

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