NXP USA Inc. BGU8052X

NXP USA Inc. BGU8052X electronic component

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Manufacturer
Manufacturer No
BGU8052X
Quantity
5
Availability
In Stock
Package
8-WFDFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT);
Description
IC AMP GSM 1.5GHZ-2.5GHZ 8HWSON
Detailed Description
RF Amplifier IC GSM, LTE, W-CDMA 1.5GHz ~ 2.5GHz 8-HWSON (2x2)
DataSheet
Gain
18.5dB
P1dB
18dBm
RF Type
GSM, LTE, W-CDMA
Frequency
1.5GHz ~ 2.5GHz
Packaging
Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part Status
Obsolete
Manufacturer
NXP USA Inc.
Noise Figure
0.5dB
Mounting Type
Surface Mount
Package / Case
8-WFDFN Exposed Pad
Test Frequency
1.9GHz
Current - Supply
48mA
Voltage - Supply
4.75V ~ 5.25V
Base Product Number
BGU8052
Supplier Device Package
8-HWSON (2x2)
AttributeValue
Gain18.5dB
P1dB18dBm
RF TypeGSM, LTE, W-CDMA
Frequency1.5GHz ~ 2.5GHz
PackagingTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part StatusObsolete
ManufacturerNXP USA Inc.
Noise Figure0.5dB
Mounting TypeSurface Mount
Package / Case8-WFDFN Exposed Pad
Test Frequency1.9GHz
Current - Supply48mA
Voltage - Supply4.75V ~ 5.25V
Base Product NumberBGU8052
Supplier Device Package8-HWSON (2x2)

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Packing

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Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
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Step3: Anti-StaticBag
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Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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