Microchip Technology MPFS250T-FCG1152E

Microchip Technology MPFS250T-FCG1152E electronic component

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Manufacturer No
MPFS250T-FCG1152E
Package
1152-BBGA, FCBGA
Packaging
Tray
Description
IC SOC RISC-V 1152FCBGA
Detailed Description
RISC-V System On Chip (SOC) IC PolarFire® FPGA - 254K Logic Modules 1152-FCBGA (35x35)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Series
PolarFire®
RAM Size
2.2MB
Packaging
Tray
Flash Size
128kB
Peripherals
DMA, PCI, PWM
Architecture
MPU, FPGA
Connectivity
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Manufacturer
Microchip Technology
Number of I/O
MCU - 136, FPGA - 372
Core Processor
RISC-V
Package / Case
1152-BBGA, FCBGA
Primary Attributes
FPGA - 254K Logic Modules
Operating Temperature
0°C ~ 100°C
Supplier Device Package
1152-FCBGA (35x35)
AttributeValue
SeriesPolarFire®
RAM Size2.2MB
PackagingTray
Flash Size128kB
PeripheralsDMA, PCI, PWM
ArchitectureMPU, FPGA
ConnectivityCAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
ManufacturerMicrochip Technology
Number of I/OMCU - 136, FPGA - 372
Core ProcessorRISC-V
Package / Case1152-BBGA, FCBGA
Primary AttributesFPGA - 254K Logic Modules
Operating Temperature0°C ~ 100°C
Supplier Device Package1152-FCBGA (35x35)

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Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

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