Microchip Technology M2S150T-1FCV484M

Microchip Technology M2S150T-1FCV484M electronic component

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Manufacturer No
M2S150T-1FCV484M
Package
484-BFBGA
Packaging
Tray
Description
FPGA 484-BGA
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 150K Logic Modules 166MHz 484-FBGA (19x19)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Speed
166MHz
Series
SmartFusion®2
RAM Size
64KB
Packaging
Tray
Flash Size
512KB
Peripherals
DDR, PCIe, SERDES
Architecture
MCU, FPGA
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer
Microchip Technology
Number of I/O
273
Core Processor
ARM® Cortex®-M3
Package / Case
484-BFBGA
Primary Attributes
FPGA - 150K Logic Modules
Operating Temperature
-55°C ~ 125°C (TJ)
Supplier Device Package
484-FBGA (19x19)
AttributeValue
Speed166MHz
SeriesSmartFusion®2
RAM Size64KB
PackagingTray
Flash Size512KB
PeripheralsDDR, PCIe, SERDES
ArchitectureMCU, FPGA
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
ManufacturerMicrochip Technology
Number of I/O273
Core ProcessorARM® Cortex®-M3
Package / Case484-BFBGA
Primary AttributesFPGA - 150K Logic Modules
Operating Temperature-55°C ~ 125°C (TJ)
Supplier Device Package484-FBGA (19x19)

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Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
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