Infineon Technologies Americas Corp. FF4MR12W2M1HPB11ABPSA1

Infineon Technologies Americas Corp. FF4MR12W2M1HPB11ABPSA1 electronic component

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Manufacturer No
FF4MR12W2M1HPB11ABPSA1
Package
Module
Packaging
Tray
Description
FF4MR12W2M1HPB11ABPSA1
Detailed Description
Mosfet Array 1200V (1.2kV) 190A 20mW Chassis Mount AG-EASY2B
DataSheet
Series
CoolSiC™
Packaging
Tray
Technology
Silicon Carbide (SiC)
Part Status
Active
Power - Max
20mW
Manufacturer
Infineon Technologies Americas Corp.
Configuration
2 N-Channel (Half Bridge)
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
5.15V @ 80mA
Operating Temperature
-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs
6mOhm @ 200A, 18V
Supplier Device Package
AG-EASY2B
Gate Charge (Qg) (Max) @ Vgs
594nC @ 18V
Drain to Source Voltage (Vdss)
1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds
17600pF @ 800V
Current - Continuous Drain (Id) @ 25°C
190A
AttributeValue
SeriesCoolSiC™
PackagingTray
TechnologySilicon Carbide (SiC)
Part StatusActive
Power - Max20mW
ManufacturerInfineon Technologies Americas Corp.
Configuration2 N-Channel (Half Bridge)
Mounting TypeChassis Mount
Package / CaseModule
Vgs(th) (Max) @ Id5.15V @ 80mA
Operating Temperature-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs6mOhm @ 200A, 18V
Supplier Device PackageAG-EASY2B
Gate Charge (Qg) (Max) @ Vgs594nC @ 18V
Drain to Source Voltage (Vdss)1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds17600pF @ 800V
Current - Continuous Drain (Id) @ 25°C190A

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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