Step1: Product
Boyd Laconia, LLC EA-425-H175-T710
Image shown is a representation only
Manufacturer
Manufacturer No
EA-425-H175-T710
Packaging
Bulk
Description
STD,EA-425-H175-T710, CLIP ATTAC
Detailed Description
Heat Sink BGA, FPGA Aluminum Top Mount
Mfr
Boyd Laconia, LLC
Type
Top Mount
Shape
Square, Fins
Width
1.673" (42.50mm)
Length
1.673" (42.50mm)
Series
EA-425
Material
Aluminum
Packaging
Bulk
Fin Height
0.689" (17.50mm)
Package Cooled
BGA, FPGA
Material Finish
Black Anodized
Attachment Method
Clip
Thermal Resistance @ Natural
18.70°C/W
Thermal Resistance @ Forced Air Flow
8.80°C/W @ 200 LFM
| Attribute | Value |
|---|---|
| Mfr | Boyd Laconia, LLC |
| Type | Top Mount |
| Shape | Square, Fins |
| Width | 1.673" (42.50mm) |
| Length | 1.673" (42.50mm) |
| Series | EA-425 |
| Material | Aluminum |
| Packaging | Bulk |
| Fin Height | 0.689" (17.50mm) |
| Package Cooled | BGA, FPGA |
| Material Finish | Black Anodized |
| Attachment Method | Clip |
| Thermal Resistance @ Natural | 18.70°C/W |
| Thermal Resistance @ Forced Air Flow | 8.80°C/W @ 200 LFM |
Purchase & Inquiry
Placing an Order
You may place an order on DAXIN without creating an account.
Available Payment Methods
For your convenience, we accept several payment methods in USD, including PayPal, credit card, and wire transfer.
RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 4, 2026 - Oct 5, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
