Boyd Laconia, LLC EA-425-H125-T710

Boyd Laconia, LLC EA-425-H125-T710 electronic component

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Manufacturer
Manufacturer No
EA-425-H125-T710
Packaging
Bulk
Description
STD,EA-425-H125-T710, CLIP ATTAC
Detailed Description
Heat Sink BGA, FPGA Aluminum Top Mount
Mfr
Boyd Laconia, LLC
Type
Top Mount
Shape
Square, Fins
Width
1.673" (42.50mm)
Length
1.673" (42.50mm)
Series
EA-425
Material
Aluminum
Packaging
Bulk
Fin Height
0.492" (12.50mm)
Part Status
Active
Package Cooled
BGA, FPGA
Material Finish
Black Anodized
Attachment Method
Clip
Thermal Resistance @ Natural
24.50°C/W
Thermal Resistance @ Forced Air Flow
11.40°C/W @ 200 LFM
AttributeValue
MfrBoyd Laconia, LLC
TypeTop Mount
ShapeSquare, Fins
Width1.673" (42.50mm)
Length1.673" (42.50mm)
SeriesEA-425
MaterialAluminum
PackagingBulk
Fin Height0.492" (12.50mm)
Part StatusActive
Package CooledBGA, FPGA
Material FinishBlack Anodized
Attachment MethodClip
Thermal Resistance @ Natural24.50°C/W
Thermal Resistance @ Forced Air Flow11.40°C/W @ 200 LFM

Purchase & Inquiry

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Means of Payment

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RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.

Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1.You'l receive an order information email in your inbox (Please remember to check the spam folder if you didn't hear from us)

2.Since inventories and prices may fuctuate to some extent, the sales manager is going to reconfirm the order and let you know

Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.