Winbond Electronics W66AP6NBQAGJ

Winbond Electronics W66AP6NBQAGJ electronic component

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Manufacturer No
W66AP6NBQAGJ
Quantity
78325
Availability
In Stock
Package
200-TFBGA
Packaging
Tray
Description
IC DRAM 1GBIT LVSTL 200TFBGA
Detailed Description
SDRAM - Mobile LPDDR4 Memory IC 1Gbit LVSTL_11 1.867 GHz 3.6 ns 200-TFBGA (10x14.5)
DataSheet
Mfr
Winbond Electronics
Packaging
Tray
Technology
SDRAM - Mobile LPDDR4
Access Time
3.6 ns
Memory Size
1Gbit
Memory Type
Volatile
Part Status
Not For New Designs
Memory Format
DRAM
Mounting Type
Surface Mount
Package / Case
200-TFBGA
Clock Frequency
1.867 GHz
Memory Interface
LVSTL_11
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.95V
Base Product Number
W66AP6
Memory Organization
64M x 16
Operating Temperature
-40°C ~ 105°C (TC)
Supplier Device Package
200-TFBGA (10x14.5)
Write Cycle Time - Word, Page
18ns
AttributeValue
MfrWinbond Electronics
PackagingTray
TechnologySDRAM - Mobile LPDDR4
Access Time3.6 ns
Memory Size1Gbit
Memory TypeVolatile
Part StatusNot For New Designs
Memory FormatDRAM
Mounting TypeSurface Mount
Package / Case200-TFBGA
Clock Frequency1.867 GHz
Memory InterfaceLVSTL_11
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
Base Product NumberW66AP6
Memory Organization64M x 16
Operating Temperature-40°C ~ 105°C (TC)
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.