Toshiba Semiconductor and Storage TB67B000HG

Toshiba Semiconductor and Storage TB67B000HG electronic component

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Manufacturer No
TB67B000HG
Package
30-PowerDIP Module
Packaging
Tray
Description
IC MOTOR DRVR 13.5V-16.5V 30HDIP
Detailed Description
Motor Driver IGBT PWM 30-HDIP
DataSheet
Function
Driver - Fully Integrated, Control and Power Stage
Interface
PWM
Packaging
Tray
Technology
IGBT
Part Status
Obsolete
Applications
General Purpose
Manufacturer
Toshiba Semiconductor and Storage
Mounting Type
Through Hole
Package / Case
30-PowerDIP Module
Voltage - Load
50V ~ 450V
Current - Output
2A
Voltage - Supply
13.5V ~ 16.5V
Base Product Number
TB67B000
Motor Type - AC, DC
Brushless DC (BLDC)
Output Configuration
Half Bridge (3)
Operating Temperature
-30°C ~ 115°C (TA)
Supplier Device Package
30-HDIP
AttributeValue
FunctionDriver - Fully Integrated, Control and Power Stage
InterfacePWM
PackagingTray
TechnologyIGBT
Part StatusObsolete
ApplicationsGeneral Purpose
ManufacturerToshiba Semiconductor and Storage
Mounting TypeThrough Hole
Package / Case30-PowerDIP Module
Voltage - Load50V ~ 450V
Current - Output2A
Voltage - Supply13.5V ~ 16.5V
Base Product NumberTB67B000
Motor Type - AC, DCBrushless DC (BLDC)
Output ConfigurationHalf Bridge (3)
Operating Temperature-30°C ~ 115°C (TA)
Supplier Device Package30-HDIP

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Packing

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Step1: Product
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Step2: Vacuum Packaging
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Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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