TDK InvenSense EV_MOD_CH201-00-01

TDK InvenSense EV_MOD_CH201-00-01 electronic component

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Manufacturer
Manufacturer No
EV_MOD_CH201-00-01
Packaging
Tray
Description
CHIRP EVAL BRD FOR CH201
Detailed Description
CH-201 - Ultrasonic, 3D Time-of-Flight (ToF) Sensor Evaluation Board
DataSheet
Contents
Board(s)
Interface
I2C
Packaging
Tray
Part Status
Active
Sensor Type
Ultrasonic, 3D Time-of-Flight (ToF)
Manufacturer
TDK InvenSense
Voltage - Supply
1.8V
Utilized IC / Part
CH-201
Base Product Number
MOD_CH201
AttributeValue
ContentsBoard(s)
InterfaceI2C
PackagingTray
Part StatusActive
Sensor TypeUltrasonic, 3D Time-of-Flight (ToF)
ManufacturerTDK InvenSense
Voltage - Supply1.8V
Utilized IC / PartCH-201
Base Product NumberMOD_CH201

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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