STMicroelectronics TSV912IQ2T

STMicroelectronics TSV912IQ2T electronic component

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Manufacturer
Manufacturer No
TSV912IQ2T
Quantity
13926
Availability
In Stock
Package
8-UFDFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT);
Description
IC OPAMP GP 2 CIRCUIT 8DFN
Detailed Description
Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 8-DFN (2x2)
DataSheet
Mfr
STMicroelectronics
Packaging
Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Slew Rate
4.5V/µs
Output Type
Rail-to-Rail
Part Status
Active
Mounting Type
Surface Mount
Amplifier Type
Standard (General Purpose)
Package / Case
8-UFDFN Exposed Pad
Current - Supply
780µA (x2 Channels)
Number of Circuits
2
Base Product Number
TSV912
Current - Input Bias
1 pA
Operating Temperature
-40°C ~ 125°C
Gain Bandwidth Product
8 MHz
Voltage - Input Offset
4.5 mV
Supplier Device Package
8-DFN (2x2)
Current - Output / Channel
35 mA
Voltage - Supply Span (Max)
5.5 V
Voltage - Supply Span (Min)
2.5 V
AttributeValue
MfrSTMicroelectronics
PackagingTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Slew Rate4.5V/µs
Output TypeRail-to-Rail
Part StatusActive
Mounting TypeSurface Mount
Amplifier TypeStandard (General Purpose)
Package / Case8-UFDFN Exposed Pad
Current - Supply780µA (x2 Channels)
Number of Circuits2
Base Product NumberTSV912
Current - Input Bias1 pA
Operating Temperature-40°C ~ 125°C
Gain Bandwidth Product8 MHz
Voltage - Input Offset4.5 mV
Supplier Device Package8-DFN (2x2)
Current - Output / Channel35 mA
Voltage - Supply Span (Max)5.5 V
Voltage - Supply Span (Min)2.5 V

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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