Same Sky (Formerly CUI Devices) HSB03-141406

Same Sky (Formerly CUI Devices) HSB03-141406 electronic component

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Manufacturer No
HSB03-141406
Packaging
Box
Description
HEAT SINK, BGA, 14 X 14 X 6 MM
Detailed Description
Heat Sink BGA Aluminum Alloy 2.1W @ 75°C Top Mount
DataSheet
Mfr
Same Sky (Formerly CUI Devices)
Type
Top Mount
Shape
Square, Pin Fins
Width
0.551" (14.00mm)
Length
0.551" (14.00mm)
Series
HSB
Material
Aluminum Alloy
Packaging
Box
Fin Height
0.236" (6.00mm)
Part Status
Active
Package Cooled
BGA
Material Finish
Black Anodized
Attachment Method
Adhesive (Not Included)
Thermal Resistance @ Natural
35.98°C/W
Power Dissipation @ Temperature Rise
2.1W @ 75°C
Thermal Resistance @ Forced Air Flow
15.80°C/W @ 200 LFM
AttributeValue
MfrSame Sky (Formerly CUI Devices)
TypeTop Mount
ShapeSquare, Pin Fins
Width0.551" (14.00mm)
Length0.551" (14.00mm)
SeriesHSB
MaterialAluminum Alloy
PackagingBox
Fin Height0.236" (6.00mm)
Part StatusActive
Package CooledBGA
Material FinishBlack Anodized
Attachment MethodAdhesive (Not Included)
Thermal Resistance @ Natural35.98°C/W
Power Dissipation @ Temperature Rise2.1W @ 75°C
Thermal Resistance @ Forced Air Flow15.80°C/W @ 200 LFM

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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