Renesas Electronics Corporation R9A07G044L23GBG#BC0

Renesas Electronics Corporation R9A07G044L23GBG#BC0 electronic component

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Manufacturer No
R9A07G044L23GBG#BC0
Date Code
22+
Quantity
2,000
Availability
In Stock
Package
456-LFBGA
Packaging
Tray
Description
SOC RZ/G2L 15MMBGA NON-SECUE DUA
Detailed Description
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G2L 3 Core, 64-Bit 200MHz, 1.2GHz 456-LFBGA (15x15)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
USB
USB 2.0 (2)
Speed
200MHz, 1.2GHz
Series
RZ/G2L
Ethernet
10/100/1000Mbps (2)
Packaging
Tray
Manufacturer
Renesas Electronics Corporation
Mounting Type
Surface Mount
Voltage - I/O
1.8V, 3.3V
Core Processor
ARM® Cortex®-A55, ARM® Cortex®-M33
Package / Case
456-LFBGA
RAM Controllers
DDR3L, DDR4
Co-Processors/DSP
ARM® Mali-G31
Base Product Number
R9A07
Additional Interfaces
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
Graphics Acceleration
No
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
456-LFBGA (15x15)
Number of Cores/Bus Width
3 Core, 64-Bit
Display & Interface Controllers
MIPI-CSI, MIPI-DSI
AttributeValue
USBUSB 2.0 (2)
Speed200MHz, 1.2GHz
SeriesRZ/G2L
Ethernet10/100/1000Mbps (2)
PackagingTray
ManufacturerRenesas Electronics Corporation
Mounting TypeSurface Mount
Voltage - I/O1.8V, 3.3V
Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33
Package / Case456-LFBGA
RAM ControllersDDR3L, DDR4
Co-Processors/DSPARM® Mali-G31
Base Product NumberR9A07
Additional InterfacesCANbus, eMMC/SD/SDIO, I2C, SPI, UART
Graphics AccelerationNo
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package456-LFBGA (15x15)
Number of Cores/Bus Width3 Core, 64-Bit
Display & Interface ControllersMIPI-CSI, MIPI-DSI

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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