Renesas Electronics Corporation R9A06G037GNP#AA0

Renesas Electronics Corporation R9A06G037GNP#AA0 electronic component

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Manufacturer No
R9A06G037GNP#AA0
Quantity
5
Availability
In Stock
Package
64-VFQFN Exposed Pad
Packaging
Tray
Description
SOC PLC MODEM LSI SMART GRID ASS
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC RZ/T 138MHz 64-HVQFN (9x9)
DataSheet
Speed
138MHz
Series
RZ/T
RAM Size
128kB
Packaging
Tray
Part Status
Active
Peripherals
PWM
Architecture
DSP, MCU
Connectivity
CSI, I2C, UART
Manufacturer
Renesas Electronics Corporation
Number of I/O
16
Core Processor
ARM® Cortex®-M3
Package / Case
64-VFQFN Exposed Pad
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
64-HVQFN (9x9)
AttributeValue
Speed138MHz
SeriesRZ/T
RAM Size128kB
PackagingTray
Part StatusActive
PeripheralsPWM
ArchitectureDSP, MCU
ConnectivityCSI, I2C, UART
ManufacturerRenesas Electronics Corporation
Number of I/O16
Core ProcessorARM® Cortex®-M3
Package / Case64-VFQFN Exposed Pad
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package64-HVQFN (9x9)

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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