Power Integrations LCS708HG

Power Integrations LCS708HG electronic component

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Manufacturer
Manufacturer No
LCS708HG
Package
16-SSIP, 13 Leads, Exposed Pad, Formed Leads
Packaging
Tube
Description
IC HALF BRIDGE DRIVER ESIP16J
Detailed Description
Half Bridge Driver General Purpose Power MOSFET eSIP-16J
DataSheet
Series
HiperLCS™
Features
Auto Restart, Slew Rate Controlled
Interface
On/Off
Load Type
Inductive
Packaging
Tube
Technology
Power MOSFET
Part Status
Last Time Buy
Applications
General Purpose
Manufacturer
Power Integrations
Rds On (Typ)
260mOhm
Mounting Type
Through Hole
Package / Case
16-SSIP, 13 Leads, Exposed Pad, Formed Leads
Voltage - Load
11.4V ~ 15V
Fault Protection
Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Voltage - Supply
11.4V ~ 15V
Base Product Number
LCS708
Output Configuration
Half Bridge
Current - Peak Output
30.9A
Operating Temperature
-40°C ~ 150°C (TJ)
Supplier Device Package
eSIP-16J
AttributeValue
SeriesHiperLCS™
FeaturesAuto Restart, Slew Rate Controlled
InterfaceOn/Off
Load TypeInductive
PackagingTube
TechnologyPower MOSFET
Part StatusLast Time Buy
ApplicationsGeneral Purpose
ManufacturerPower Integrations
Rds On (Typ)260mOhm
Mounting TypeThrough Hole
Package / Case16-SSIP, 13 Leads, Exposed Pad, Formed Leads
Voltage - Load11.4V ~ 15V
Fault ProtectionCurrent Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Voltage - Supply11.4V ~ 15V
Base Product NumberLCS708
Output ConfigurationHalf Bridge
Current - Peak Output30.9A
Operating Temperature-40°C ~ 150°C (TJ)
Supplier Device PackageeSIP-16J

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