NXP USA Inc. S912ZVML12F3WKH

NXP USA Inc. S912ZVML12F3WKH electronic component

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Manufacturer
Manufacturer No
S912ZVML12F3WKH
Quantity
279
Availability
In Stock
Package
64-LQFP Exposed Pad
Packaging
Tray
Description
IC MCU 16BIT 128KB FLASH 64LQFP
Detailed Description
S12Z S12 MagniV Microcontroller IC 16-Bit 50MHz 128KB (128K x 8) FLASH 64-HLQFP (10x10)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
NXP USA Inc.
Speed
50MHz
Series
S12 MagniV
RAM Size
8K x 8
Core Size
16-Bit
Packaging
Tray
EEPROM Size
512 x 8
Peripherals
DMA, POR, PWM, WDT
Connectivity
LINbus, SCI, SPI
Mounting Type
Surface Mount
Number of I/O
31
Core Processor
S12Z
Package / Case
64-LQFP Exposed Pad
Data Converters
A/D 9x12b
Oscillator Type
Internal
Base Product Number
S912
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 150°C (TA)
Supplier Device Package
64-HLQFP (10x10)
Voltage - Supply (Vcc/Vdd)
3.5V ~ 40V
AttributeValue
MfrNXP USA Inc.
Speed50MHz
SeriesS12 MagniV
RAM Size8K x 8
Core Size16-Bit
PackagingTray
EEPROM Size512 x 8
PeripheralsDMA, POR, PWM, WDT
ConnectivityLINbus, SCI, SPI
Mounting TypeSurface Mount
Number of I/O31
Core ProcessorS12Z
Package / Case64-LQFP Exposed Pad
Data ConvertersA/D 9x12b
Oscillator TypeInternal
Base Product NumberS912
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 150°C (TA)
Supplier Device Package64-HLQFP (10x10)
Voltage - Supply (Vcc/Vdd)3.5V ~ 40V

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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