NXP USA Inc. MKL17Z64VDA4R

NXP USA Inc. MKL17Z64VDA4R electronic component

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Manufacturer
Manufacturer No
MKL17Z64VDA4R
Package
36-XFBGA
Packaging
Tape & Reel (TR)
Description
IC MCU 32BIT 64KB FLASH 36XFBGA
Detailed Description
ARM® Cortex®-M0+ Kinetis KL1 Microcontroller IC 32-Bit 48MHz 64KB (64K x 8) FLASH 36-XFBGA (3.5x3.5)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
NXP USA Inc.
Speed
48MHz
Series
Kinetis KL1
RAM Size
16K x 8
Core Size
32-Bit
Packaging
Tape & Reel (TR)
Peripherals
DMA, I2S, PWM, WDT
Connectivity
I2C, FlexIO, SPI, UART/USART
Mounting Type
Surface Mount
Number of I/O
32
Core Processor
ARM® Cortex®-M0+
Package / Case
36-XFBGA
Data Converters
A/D 15x16b
Oscillator Type
Internal
Base Product Number
MKL17Z64
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
36-XFBGA (3.5x3.5)
Voltage - Supply (Vcc/Vdd)
1.71V ~ 3.6V
AttributeValue
MfrNXP USA Inc.
Speed48MHz
SeriesKinetis KL1
RAM Size16K x 8
Core Size32-Bit
PackagingTape & Reel (TR)
PeripheralsDMA, I2S, PWM, WDT
ConnectivityI2C, FlexIO, SPI, UART/USART
Mounting TypeSurface Mount
Number of I/O32
Core ProcessorARM® Cortex®-M0+
Package / Case36-XFBGA
Data ConvertersA/D 15x16b
Oscillator TypeInternal
Base Product NumberMKL17Z64
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package36-XFBGA (3.5x3.5)
Voltage - Supply (Vcc/Vdd)1.71V ~ 3.6V

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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