NXP USA Inc. LPC55S69JBD100E

NXP USA Inc. LPC55S69JBD100E electronic component

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Manufacturer
Manufacturer No
LPC55S69JBD100E
Quantity
40
Availability
In Stock
Package
100-LQFP Exposed Pad
Packaging
Tray
Description
IC MCU 32BIT 640KB FLASH 100LQFP
Detailed Description
ARM® Cortex®-M33 LPC55S6x Microcontroller IC 32-Bit Dual-Core 150MHz 640KB (640K x 8) FLASH 100-HLQFP (14x14)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
NXP USA Inc.
Speed
150MHz
Series
LPC55S6x
RAM Size
320K x 8
Core Size
32-Bit Dual-Core
Packaging
Tray
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Mounting Type
Surface Mount
Number of I/O
64
Core Processor
ARM® Cortex®-M33
Package / Case
100-LQFP Exposed Pad
Data Converters
A/D 10x16b SAR
Oscillator Type
Internal
Base Product Number
LPC55S69
Program Memory Size
640KB (640K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
100-HLQFP (14x14)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
AttributeValue
MfrNXP USA Inc.
Speed150MHz
SeriesLPC55S6x
RAM Size320K x 8
Core Size32-Bit Dual-Core
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
ConnectivityFlexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Mounting TypeSurface Mount
Number of I/O64
Core ProcessorARM® Cortex®-M33
Package / Case100-LQFP Exposed Pad
Data ConvertersA/D 10x16b SAR
Oscillator TypeInternal
Base Product NumberLPC55S69
Program Memory Size640KB (640K x 8)
Program Memory TypeFLASH
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package100-HLQFP (14x14)
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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