NXP USA Inc. LPC18S57JET256E

NXP USA Inc. LPC18S57JET256E electronic component

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Manufacturer
Manufacturer No
LPC18S57JET256E
Quantity
3
Availability
In Stock
Package
256-LBGA
Packaging
Tray
Description
IC MCU 32BIT 1MB FLASH 256LBGA
Detailed Description
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit 180MHz 1MB (1M x 8) FLASH 256-LBGA (17x17)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
NXP USA Inc.
Speed
180MHz
Series
LPC18xx
RAM Size
136K x 8
Core Size
32-Bit
Packaging
Tray
Peripherals
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Mounting Type
Surface Mount
Number of I/O
164
Core Processor
ARM® Cortex®-M3
Package / Case
256-LBGA
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Base Product Number
LPC18S57
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
AttributeValue
MfrNXP USA Inc.
Speed180MHz
SeriesLPC18xx
RAM Size136K x 8
Core Size32-Bit
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Mounting TypeSurface Mount
Number of I/O164
Core ProcessorARM® Cortex®-M3
Package / Case256-LBGA
Data ConvertersA/D 8x10b; D/A 1x10b
Oscillator TypeInternal
Base Product NumberLPC18S57
Program Memory Size1MB (1M x 8)
Program Memory TypeFLASH
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd)2.2V ~ 3.6V

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 4, 2026 - Oct 5, 2026
Shipping Fee
Calculated based on your destination

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