NXP Semiconductors PMCXB900UEZ

NXP Semiconductors PMCXB900UEZ electronic component

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Manufacturer
Manufacturer No
PMCXB900UEZ
Package
6-XFDFN Exposed Pad
Packaging
Bulk
Description
MOSFET N/P-CH 20V 0.6A 6DFN
Detailed Description
Mosfet Array 20V 600mA, 500mA 265mW Surface Mount DFN1010B-6
DataSheet
Series
TrenchFET®
Packaging
Bulk
Technology
MOSFET (Metal Oxide)
FET Feature
Logic Level Gate
Part Status
Active
Power - Max
265mW
Manufacturer
NXP Semiconductors
Configuration
N and P-Channel Complementary
Mounting Type
Surface Mount
Package / Case
6-XFDFN Exposed Pad
Vgs(th) (Max) @ Id
950mV @ 250µA
Base Product Number
PMCXB900
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
620mOhm @ 600mA, 4.5V
Supplier Device Package
DFN1010B-6
Gate Charge (Qg) (Max) @ Vgs
0.7nC @ 4.5V
Drain to Source Voltage (Vdss)
20V
Input Capacitance (Ciss) (Max) @ Vds
21.3pF @ 10V
Current - Continuous Drain (Id) @ 25°C
600mA, 500mA
AttributeValue
SeriesTrenchFET®
PackagingBulk
TechnologyMOSFET (Metal Oxide)
FET FeatureLogic Level Gate
Part StatusActive
Power - Max265mW
ManufacturerNXP Semiconductors
ConfigurationN and P-Channel Complementary
Mounting TypeSurface Mount
Package / Case6-XFDFN Exposed Pad
Vgs(th) (Max) @ Id950mV @ 250µA
Base Product NumberPMCXB900
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs620mOhm @ 600mA, 4.5V
Supplier Device PackageDFN1010B-6
Gate Charge (Qg) (Max) @ Vgs0.7nC @ 4.5V
Drain to Source Voltage (Vdss)20V
Input Capacitance (Ciss) (Max) @ Vds21.3pF @ 10V
Current - Continuous Drain (Id) @ 25°C600mA, 500mA

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Packing

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Step2: Vacuum Packaging
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Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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