NXP Semiconductors NX3L2G384GM,125

NXP Semiconductors NX3L2G384GM,125 electronic component

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Manufacturer
Manufacturer No
NX3L2G384GM,125
Package
8-XFQFN Exposed Pad
Packaging
Bulk
Description
IC SW SPST-NOX2 900MOHM 8XQFN
Detailed Description
2 Circuit IC Switch 1:1 900mOhm 8-XQFN (1.6x1.6)
DataSheet
Crosstalk
-90dB @ 100kHz
Packaging
Bulk
Part Status
Obsolete
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
-3db Bandwidth
60MHz
Package / Case
8-XFQFN Exposed Pad
Switch Circuit
SPST - NO
Charge Injection
6pC
Number of Circuits
2
Operating Temperature
-40°C ~ 125°C (TA)
Supplier Device Package
8-XQFN (1.6x1.6)
On-State Resistance (Max)
900mOhm
Switch Time (Ton, Toff) (Max)
24ns, 7ns
Voltage - Supply, Single (V+)
1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)
10nA
Multiplexer/Demultiplexer Circuit
1:1
Channel-to-Channel Matching (ΔRon)
20mOhm
Channel Capacitance (CS(off), CD(off))
35pF
AttributeValue
Crosstalk-90dB @ 100kHz
PackagingBulk
Part StatusObsolete
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
-3db Bandwidth60MHz
Package / Case8-XFQFN Exposed Pad
Switch CircuitSPST - NO
Charge Injection6pC
Number of Circuits2
Operating Temperature-40°C ~ 125°C (TA)
Supplier Device Package8-XQFN (1.6x1.6)
On-State Resistance (Max)900mOhm
Switch Time (Ton, Toff) (Max)24ns, 7ns
Voltage - Supply, Single (V+)1.4V ~ 4.3V
Current - Leakage (IS(off)) (Max)10nA
Multiplexer/Demultiplexer Circuit1:1
Channel-to-Channel Matching (ΔRon)20mOhm
Channel Capacitance (CS(off), CD(off))35pF

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