NXP Semiconductors BGA3031X

NXP Semiconductors BGA3031X electronic component

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Manufacturer
Manufacturer No
BGA3031X
Package
20-VQFN Exposed Pad
Packaging
Bulk
Description
BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Detailed Description
RF Amplifier IC 20-HVQFN (5x5)
DataSheet
Packaging
Bulk
Part Status
Obsolete
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
Package / Case
20-VQFN Exposed Pad
Supplier Device Package
20-HVQFN (5x5)
AttributeValue
PackagingBulk
Part StatusObsolete
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
Package / Case20-VQFN Exposed Pad
Supplier Device Package20-HVQFN (5x5)

Purchase & Inquiry

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RFQ (Request for Quotations)

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IMPORTANT NOTICE

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2.Since inventories and prices may fuctuate to some extent, the sales manager is going to reconfirm the order and let you know

Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.