Step1: Product
Microchip Technology MIC864YMX-T5
Image shown is a representation only
Manufacturer
Manufacturer No
MIC864YMX-T5
Package
10-XFDFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC OPAMP GP 2 CIRCUIT 10TDFN
Detailed Description
Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 10-TDFN (2.5x2.5)
Datasheet
Mfr
Microchip Technology
Packaging
Tape & Reel (TR)
Slew Rate
0.2V/µs
Output Type
Rail-to-Rail
Mounting Type
Surface Mount
Amplifier Type
Standard (General Purpose)
Package / Case
10-XFDFN Exposed Pad
Current - Supply
33µA (x2 Channels)
Number of Circuits
2
Base Product Number
MIC864
Current - Input Bias
2.5 pA
Operating Temperature
-40°C ~ 125°C
Gain Bandwidth Product
350 kHz
Voltage - Input Offset
2 mV
Supplier Device Package
10-TDFN (2.5x2.5)
Current - Output / Channel
23 mA
Voltage - Supply Span (Max)
5.5 V
Voltage - Supply Span (Min)
2.5 V
| Attribute | Value |
|---|---|
| Mfr | Microchip Technology |
| Packaging | Tape & Reel (TR) |
| Slew Rate | 0.2V/µs |
| Output Type | Rail-to-Rail |
| Mounting Type | Surface Mount |
| Amplifier Type | Standard (General Purpose) |
| Package / Case | 10-XFDFN Exposed Pad |
| Current - Supply | 33µA (x2 Channels) |
| Number of Circuits | 2 |
| Base Product Number | MIC864 |
| Current - Input Bias | 2.5 pA |
| Operating Temperature | -40°C ~ 125°C |
| Gain Bandwidth Product | 350 kHz |
| Voltage - Input Offset | 2 mV |
| Supplier Device Package | 10-TDFN (2.5x2.5) |
| Current - Output / Channel | 23 mA |
| Voltage - Supply Span (Max) | 5.5 V |
| Voltage - Supply Span (Min) | 2.5 V |
Purchase & Inquiry
Placing an Order
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Available Payment Methods
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RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 3, 2026 - Oct 4, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
