Step1: Product
Microchip Technology ICPB1010-1-110I
Image shown is a representation only
Manufacturer
Manufacturer No
ICPB1010-1-110I
Package
Die
Packaging
Box
Description
DC-14 GHZ 50W DISCRETE GAN HEMT
Detailed Description
RF Mosfet 28 V 500 mA 14GHz 6.1dB 50W Die
Datasheet
Gain
6.1dB
Frequency
14GHz
Packaging
Box
Technology
GaN HEMT
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Current - Test
500 mA
Package / Case
Die
Power - Output
50W
Voltage - Test
28 V
Voltage - Rated
28 V
Current Rating (Amps)
4A
Supplier Device Package
Die
| Attribute | Value |
|---|---|
| Gain | 6.1dB |
| Frequency | 14GHz |
| Packaging | Box |
| Technology | GaN HEMT |
| Manufacturer | Microchip Technology |
| Mounting Type | Surface Mount |
| Current - Test | 500 mA |
| Package / Case | Die |
| Power - Output | 50W |
| Voltage - Test | 28 V |
| Voltage - Rated | 28 V |
| Current Rating (Amps) | 4A |
| Supplier Device Package | Die |
Purchase & Inquiry
Placing an Order
You may place an order on DAXIN without creating an account.
Available Payment Methods
For your convenience, we accept several payment methods in USD, including PayPal, credit card, and wire transfer.
RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 3, 2026 - Oct 4, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
