Lumissil Microsystems X1600

Lumissil Microsystems X1600 electronic component

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Manufacturer No
X1600
Package
159-LFBGA
Packaging
Tape & Reel (TR); Cut Tape (CT);
Description
IC MPU 1GHZ 159BGA
Detailed Description
XBurst® 1 Microprocessor IC - 1 Core 1GHz 159-BGA (9x9)
DataSheet
USB
USB 2.0 OTG (1)
Speed
1GHz
Packaging
Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part Status
Active
Manufacturer
Lumissil Microsystems
Mounting Type
Surface Mount
Voltage - I/O
1.8V, 3.3V
Core Processor
XBurst® 1
Package / Case
159-LFBGA
RAM Controllers
DDR2,LPDDR2
Security Features
AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Additional Interfaces
AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Graphics Acceleration
Yes
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
159-BGA (9x9)
Number of Cores/Bus Width
1 Core
Display & Interface Controllers
LCD, MIPI-DBI, MIPI-DPI
AttributeValue
USBUSB 2.0 OTG (1)
Speed1GHz
PackagingTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Part StatusActive
ManufacturerLumissil Microsystems
Mounting TypeSurface Mount
Voltage - I/O1.8V, 3.3V
Core ProcessorXBurst® 1
Package / Case159-LFBGA
RAM ControllersDDR2,LPDDR2
Security FeaturesAES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Additional InterfacesAIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Graphics AccelerationYes
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package159-BGA (9x9)
Number of Cores/Bus Width1 Core
Display & Interface ControllersLCD, MIPI-DBI, MIPI-DPI

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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