Kioxia America, Inc. THGAMSG9T15BAIL

Kioxia America, Inc. THGAMSG9T15BAIL electronic component

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Manufacturer No
THGAMSG9T15BAIL
Date Code
25+
Quantity
100
Availability
In Stock
Package
153-WBGA
Packaging
Tray
Description
IC FLASH 512GBIT EMMC 153FBGA
Detailed Description
FLASH - NAND (TLC) Memory IC 512Gbit eMMC_5.1 200 MHz 153-BGA (11.5x13)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Kioxia America, Inc.
Series
e•MMC™
Packaging
Tray
Technology
FLASH - NAND (TLC)
Memory Size
512Gbit
Memory Type
Non-Volatile
Memory Format
FLASH
Mounting Type
Surface Mount
Package / Case
153-WBGA
Clock Frequency
200 MHz
Memory Interface
eMMC_5.1
Voltage - Supply
2.7V ~ 3.6V
Base Product Number
THGAMSG9
Memory Organization
64G x 8
Operating Temperature
-25°C ~ 85°C
Supplier Device Package
153-BGA (11.5x13)
AttributeValue
MfrKioxia America, Inc.
Seriese•MMC™
PackagingTray
TechnologyFLASH - NAND (TLC)
Memory Size512Gbit
Memory TypeNon-Volatile
Memory FormatFLASH
Mounting TypeSurface Mount
Package / Case153-WBGA
Clock Frequency200 MHz
Memory InterfaceeMMC_5.1
Voltage - Supply2.7V ~ 3.6V
Base Product NumberTHGAMSG9
Memory Organization64G x 8
Operating Temperature-25°C ~ 85°C
Supplier Device Package153-BGA (11.5x13)

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

Product before packing

Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

Step4: Packaging Boxes

Packaging box with shipping label

Step5: Bar-Code Shipping Tags

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Step6: Shipping