Infineon Technologies IRFR24N15DTRPBF

Infineon Technologies IRFR24N15DTRPBF electronic component

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Manufacturer No
IRFR24N15DTRPBF
Quantity
640
Availability
In Stock
Package
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging
Tape & Reel (TR); Cut Tape (CT);
Description
MOSFET N-CH 150V 24A DPAK
Detailed Description
N-Channel 150 V 24A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK)
DataSheet
Mfr
Infineon Technologies
Series
HEXFET®
FET Type
N-Channel
Packaging
Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Vgs (Max)
±30V
Technology
MOSFET (Metal Oxide)
Part Status
Active
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPAK (2 Leads + Tab), SC-63
Vgs(th) (Max) @ Id
5V @ 250µA
Base Product Number
IRFR24
Operating Temperature
-55°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs
95mOhm @ 14A, 10V
Power Dissipation (Max)
140W (Tc)
Supplier Device Package
TO-252AA (DPAK)
Gate Charge (Qg) (Max) @ Vgs
45 nC @ 10 V
Drain to Source Voltage (Vdss)
150 V
Input Capacitance (Ciss) (Max) @ Vds
890 pF @ 25 V
Drive Voltage (Max Rds On, Min Rds On)
10V
Current - Continuous Drain (Id) @ 25°C
24A (Tc)
AttributeValue
MfrInfineon Technologies
SeriesHEXFET®
FET TypeN-Channel
PackagingTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Vgs (Max)±30V
TechnologyMOSFET (Metal Oxide)
Part StatusActive
Mounting TypeSurface Mount
Package / CaseTO-252-3, DPAK (2 Leads + Tab), SC-63
Vgs(th) (Max) @ Id5V @ 250µA
Base Product NumberIRFR24
Operating Temperature-55°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs95mOhm @ 14A, 10V
Power Dissipation (Max)140W (Tc)
Supplier Device PackageTO-252AA (DPAK)
Gate Charge (Qg) (Max) @ Vgs45 nC @ 10 V
Drain to Source Voltage (Vdss)150 V
Input Capacitance (Ciss) (Max) @ Vds890 pF @ 25 V
Drive Voltage (Max Rds On, Min Rds On)10V
Current - Continuous Drain (Id) @ 25°C24A (Tc)

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Step2: Vacuum Packaging
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EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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