Infineon Technologies FF4000UXTR33T2M1BPSA1

Infineon Technologies FF4000UXTR33T2M1BPSA1 electronic component

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Manufacturer No
FF4000UXTR33T2M1BPSA1
Package
Module
Packaging
Tray
Description
MOSFET 2 N-CH 3300V XHP2K17
Detailed Description
Mosfet Array 3300V (3.3kV) 500A (Tc) Chassis Mount AG-XHP2K17
DataSheet
Series
XHP™2
Packaging
Tray
Technology
Silicon Carbide (SiC)
Part Status
Active
Manufacturer
Infineon Technologies
Configuration
2 N-Channel (Half Bridge)
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
5.55V @ 450mA
Operating Temperature
-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs
4.8mOhm @ 500A, 15V
Supplier Device Package
AG-XHP2K17
Gate Charge (Qg) (Max) @ Vgs
2500nC @ 15V
Drain to Source Voltage (Vdss)
3300V (3.3kV)
Input Capacitance (Ciss) (Max) @ Vds
101000pF @ 1800V
Current - Continuous Drain (Id) @ 25°C
500A (Tc)
AttributeValue
SeriesXHP™2
PackagingTray
TechnologySilicon Carbide (SiC)
Part StatusActive
ManufacturerInfineon Technologies
Configuration2 N-Channel (Half Bridge)
Mounting TypeChassis Mount
Package / CaseModule
Vgs(th) (Max) @ Id5.55V @ 450mA
Operating Temperature-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs4.8mOhm @ 500A, 15V
Supplier Device PackageAG-XHP2K17
Gate Charge (Qg) (Max) @ Vgs2500nC @ 15V
Drain to Source Voltage (Vdss)3300V (3.3kV)
Input Capacitance (Ciss) (Max) @ Vds101000pF @ 1800V
Current - Continuous Drain (Id) @ 25°C500A (Tc)

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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