Himax HX6537-A09TDIG

Himax HX6537-A09TDIG electronic component

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Manufacturer
Manufacturer No
HX6537-A09TDIG
Package
72-VFQFN Exposed Pad
Packaging
Tray
Description
IC MCU 2MB FLASH 72QFN
Detailed Description
ARC EM9D - Microcontroller IC 32-Bit 400MHz 320KB (320K x 8) SRAM 72-QFN (8x8)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Himax
Speed
400MHz
RAM Size
2M x 8
Core Size
32-Bit
Packaging
Tray
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, Sensor I/F, WDT
Connectivity
I2C, PDM, SPI, UART/USART
Mounting Type
Surface Mount
Number of I/O
9
Core Processor
ARC EM9D
Package / Case
72-VFQFN Exposed Pad
Data Converters
A/D 4x12b
Oscillator Type
Internal
Base Product Number
HX6537
Program Memory Size
320KB (320K x 8)
Program Memory Type
SRAM
Supplier Device Package
72-QFN (8x8)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
AttributeValue
MfrHimax
Speed400MHz
RAM Size2M x 8
Core Size32-Bit
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, Sensor I/F, WDT
ConnectivityI2C, PDM, SPI, UART/USART
Mounting TypeSurface Mount
Number of I/O9
Core ProcessorARC EM9D
Package / Case72-VFQFN Exposed Pad
Data ConvertersA/D 4x12b
Oscillator TypeInternal
Base Product NumberHX6537
Program Memory Size320KB (320K x 8)
Program Memory TypeSRAM
Supplier Device Package72-QFN (8x8)
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V

Purchase & Inquiry

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

Product before packing

Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

Step4: Packaging Boxes

Packaging box with shipping label

Step5: Bar-Code Shipping Tags

Shipping by cargo vessel

Step6: Shipping