Step1: Product
Flip Electronics LPC2138FBD64/H100
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Manufacturer
Manufacturer No
LPC2138FBD64/H100
Package
64-LQFP
Packaging
Bulk
Description
Single-chip 16/32-bit microcontr
Detailed Description
ARM7TDMI LPC213x Microcontroller IC 16/32-Bit 60MHz 512KB (512K x 8) FLASH 64-LQFP (10x10)
Mfr
Flip Electronics
Speed
60MHz
Series
LPC213x
RAM Size
32K x 8
Core Size
16/32-Bit
Packaging
Bulk
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Connectivity
I2C, Microwire, SPI, SSI, SSP, UART/USART
Mounting Type
Surface Mount
Number of I/O
47
Core Processor
ARM7TDMI
Package / Case
64-LQFP
Data Converters
A/D 16x10b SAR; D/A 1x10b
Oscillator Type
External, Internal
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
| Attribute | Value |
|---|---|
| Mfr | Flip Electronics |
| Speed | 60MHz |
| Series | LPC213x |
| RAM Size | 32K x 8 |
| Core Size | 16/32-Bit |
| Packaging | Bulk |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I2C, Microwire, SPI, SSI, SSP, UART/USART |
| Mounting Type | Surface Mount |
| Number of I/O | 47 |
| Core Processor | ARM7TDMI |
| Package / Case | 64-LQFP |
| Data Converters | A/D 16x10b SAR; D/A 1x10b |
| Oscillator Type | External, Internal |
| Program Memory Size | 512KB (512K x 8) |
| Program Memory Type | FLASH |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Supplier Device Package | 64-LQFP (10x10) |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
Purchase & Inquiry
Placing an Order
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Available Payment Methods
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RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 3, 2026 - Oct 4, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
