Flip Electronics LPC2138FBD64/H100

Flip Electronics LPC2138FBD64/H100 electronic component

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Manufacturer
Manufacturer No
LPC2138FBD64/H100
Package
64-LQFP
Packaging
Bulk
Description
Single-chip 16/32-bit microcontr
Detailed Description
ARM7TDMI LPC213x Microcontroller IC 16/32-Bit 60MHz 512KB (512K x 8) FLASH 64-LQFP (10x10)
Mfr
Flip Electronics
Speed
60MHz
Series
LPC213x
RAM Size
32K x 8
Core Size
16/32-Bit
Packaging
Bulk
Part Status
Obsolete
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Connectivity
I2C, Microwire, SPI, SSI, SSP, UART/USART
Mounting Type
Surface Mount
Number of I/O
47
Core Processor
ARM7TDMI
Package / Case
64-LQFP
Data Converters
A/D 16x10b SAR; D/A 1x10b
Oscillator Type
External, Internal
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
AttributeValue
MfrFlip Electronics
Speed60MHz
SeriesLPC213x
RAM Size32K x 8
Core Size16/32-Bit
PackagingBulk
Part StatusObsolete
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI2C, Microwire, SPI, SSI, SSP, UART/USART
Mounting TypeSurface Mount
Number of I/O47
Core ProcessorARM7TDMI
Package / Case64-LQFP
Data ConvertersA/D 16x10b SAR; D/A 1x10b
Oscillator TypeExternal, Internal
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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