Everspin Technologies Inc. MR25H40VDF

Everspin Technologies Inc. MR25H40VDF electronic component

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Manufacturer No
MR25H40VDF
Quantity
76,768
Availability
In Stock
Package
8-VDFN Exposed Pad
Packaging
Tray
Description
IC RAM 4MBIT SPI 40MHZ 8DFN
Detailed Description
MRAM (Magnetoresistive RAM) Memory IC 4Mbit SPI 40 MHz 9 ns 8-DFN-EP, Small Flag (5x6)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Mfr
Everspin Technologies Inc.
Grade
Automotive
Packaging
Tray
Technology
MRAM (Magnetoresistive RAM)
Access Time
9 ns
Memory Size
4Mbit
Memory Type
Non-Volatile
Memory Format
RAM
Mounting Type
Surface Mount
Qualification
AEC-Q100
Package / Case
8-VDFN Exposed Pad
Clock Frequency
40 MHz
Memory Interface
SPI
Voltage - Supply
3V ~ 3.6V
Base Product Number
MR25H40
Memory Organization
512K x 8
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
8-DFN-EP, Small Flag (5x6)
AttributeValue
MfrEverspin Technologies Inc.
GradeAutomotive
PackagingTray
TechnologyMRAM (Magnetoresistive RAM)
Access Time9 ns
Memory Size4Mbit
Memory TypeNon-Volatile
Memory FormatRAM
Mounting TypeSurface Mount
QualificationAEC-Q100
Package / Case8-VDFN Exposed Pad
Clock Frequency40 MHz
Memory InterfaceSPI
Voltage - Supply3V ~ 3.6V
Base Product NumberMR25H40
Memory Organization512K x 8
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package8-DFN-EP, Small Flag (5x6)

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Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

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Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

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Packaging box with shipping label

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