Everspin Technologies Inc. EM064LXQADG13ES2T

Everspin Technologies Inc. EM064LXQADG13ES2T electronic component

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Manufacturer No
EM064LXQADG13ES2T
Quantity
74478
Availability
In Stock
Package
8-VDFN Exposed Pad
Packaging
Tray
Description
IC RAM 64MBIT XSPI 8DFN
Detailed Description
MRAM (Magnetoresistive RAM) Memory IC 64Mbit SPI - Quad I/O 200 MHz 8-DFN (6x8)
DataSheet
Mfr
Everspin Technologies Inc.
Series
EMxxLX
Packaging
Tray
Technology
MRAM (Magnetoresistive RAM)
Memory Size
64Mbit
Memory Type
Non-Volatile
Part Status
Active
Memory Format
RAM
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Clock Frequency
200 MHz
Memory Interface
SPI - Quad I/O
Voltage - Supply
1.65V ~ 2V
Base Product Number
EM064LXQADG13
Memory Organization
8M x 8
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
8-DFN (6x8)
AttributeValue
MfrEverspin Technologies Inc.
SeriesEMxxLX
PackagingTray
TechnologyMRAM (Magnetoresistive RAM)
Memory Size64Mbit
Memory TypeNon-Volatile
Part StatusActive
Memory FormatRAM
Mounting TypeSurface Mount
Package / Case8-VDFN Exposed Pad
Clock Frequency200 MHz
Memory InterfaceSPI - Quad I/O
Voltage - Supply1.65V ~ 2V
Base Product NumberEM064LXQADG13
Memory Organization8M x 8
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package8-DFN (6x8)

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.