Everspin Technologies Inc. EM016LXQBB313IS2T

Everspin Technologies Inc. EM016LXQBB313IS2T electronic component

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Manufacturer No
EM016LXQBB313IS2T
Quantity
78040
Availability
In Stock
Package
24-TBGA
Packaging
Tray
Description
IC RAM 16MBIT XSPI 24TBGA
Detailed Description
MRAM (Magnetoresistive RAM) Memory IC 16Mbit SPI - Quad I/O 133 MHz 24-TBGA (6x8)
Mfr
Everspin Technologies Inc.
Series
EMxxLX
Packaging
Tray
Technology
MRAM (Magnetoresistive RAM)
Memory Size
16Mbit
Memory Type
Non-Volatile
Part Status
Active
Memory Format
RAM
Mounting Type
Surface Mount
Package / Case
24-TBGA
Clock Frequency
133 MHz
Memory Interface
SPI - Quad I/O
Voltage - Supply
1.65V ~ 2V
Base Product Number
EM016LXQ
Memory Organization
2M x 8
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
24-TBGA (6x8)
AttributeValue
MfrEverspin Technologies Inc.
SeriesEMxxLX
PackagingTray
TechnologyMRAM (Magnetoresistive RAM)
Memory Size16Mbit
Memory TypeNon-Volatile
Part StatusActive
Memory FormatRAM
Mounting TypeSurface Mount
Package / Case24-TBGA
Clock Frequency133 MHz
Memory InterfaceSPI - Quad I/O
Voltage - Supply1.65V ~ 2V
Base Product NumberEM016LXQ
Memory Organization2M x 8
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package24-TBGA (6x8)

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.