Step1: Product
EM Microelectronic EM9304V01WW31
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Manufacturer
Manufacturer No
EM9304V01WW31
Package
Die
Packaging
Tape & Reel (TR)
Description
IC RF TXRX+MCU 802.15.4 WAFER
Detailed Description
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.0, Zigbee® 2.4GHz Die
Datasheet
Mfr
EM Microelectronic
GPIO
12
Type
TxRx + MCU
Protocol
Bluetooth v5.0, Zigbee®
Frequency
2.4GHz
Packaging
Tape & Reel (TR)
Modulation
FSK
Memory Size
128kB RAM, 136kB ROM
Sensitivity
-94dBm
Mounting Type
Surface Mount
Package / Case
Die
Power - Output
6.2dBm
Data Rate (Max)
2Mbps
Voltage - Supply
1.05V ~ 1.9V
Serial Interfaces
GPIO, HCI, I2C, JTAG, SPI, UART
RF Family/Standard
802.15.4, Bluetooth
Current - Receiving
3mA ~ 5.8mA
Operating Temperature
-40°C ~ 85°C
Current - Transmitting
2.2mA ~ 14.8mA
Supplier Device Package
Wafer
| Attribute | Value |
|---|---|
| Mfr | EM Microelectronic |
| GPIO | 12 |
| Type | TxRx + MCU |
| Protocol | Bluetooth v5.0, Zigbee® |
| Frequency | 2.4GHz |
| Packaging | Tape & Reel (TR) |
| Modulation | FSK |
| Memory Size | 128kB RAM, 136kB ROM |
| Sensitivity | -94dBm |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Power - Output | 6.2dBm |
| Data Rate (Max) | 2Mbps |
| Voltage - Supply | 1.05V ~ 1.9V |
| Serial Interfaces | GPIO, HCI, I2C, JTAG, SPI, UART |
| RF Family/Standard | 802.15.4, Bluetooth |
| Current - Receiving | 3mA ~ 5.8mA |
| Operating Temperature | -40°C ~ 85°C |
| Current - Transmitting | 2.2mA ~ 14.8mA |
| Supplier Device Package | Wafer |
Purchase & Inquiry
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Important Notes
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2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 3, 2026 - Oct 4, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
