CTS Thermal Management Products BDN10-3CB/A01

CTS Thermal Management Products BDN10-3CB/A01 electronic component

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Manufacturer No
BDN10-3CB/A01
Quantity
3
Availability
In Stock
Packaging
Box
Description
HEATSINK CPU W/ADHESIVE 1.01"SQ
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
DataSheet
Mfr
CTS Thermal Management Products
Type
Top Mount
Shape
Square, Pin Fins
Width
1.010" (25.65mm)
Length
1.010" (25.65mm)
Series
BDN
Material
Aluminum
Packaging
Box
Fin Height
0.355" (9.02mm)
Shelf Life
24 Months
Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Included)
Base Product Number
BDN10
Thermal Resistance @ Natural
26.40°C/W
Thermal Resistance @ Forced Air Flow
8.00°C/W @ 400 LFM
AttributeValue
MfrCTS Thermal Management Products
TypeTop Mount
ShapeSquare, Pin Fins
Width1.010" (25.65mm)
Length1.010" (25.65mm)
SeriesBDN
MaterialAluminum
PackagingBox
Fin Height0.355" (9.02mm)
Shelf Life24 Months
Part StatusActive
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Included)
Base Product NumberBDN10
Thermal Resistance @ Natural26.40°C/W
Thermal Resistance @ Forced Air Flow8.00°C/W @ 400 LFM

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.