Corleto Industries CI-PERFBD-2-2

Corleto Industries CI-PERFBD-2-2 electronic component

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Manufacturer
Manufacturer No
CI-PERFBD-2-2
Packaging
Retail Package
Description
BREADBOARD GENERAL PURPOSE PTH
Detailed Description
Breadboard, General Purpose Plated Through Hole (PTH) Pad Per Hole (Both Sides) 0.1" (2.54mm) Grid
DataSheet
Pitch
0.1" (2.54mm) Grid
Series
CI-Perf
Plating
Plated Through Hole (PTH)
Material
FR4 Epoxy Glass
Packaging
Retail Package
Part Status
Active
Manufacturer
Corleto Industries
Edge Contacts
Custom
Hole Diameter
0.040" (1.02mm)
Board Thickness
0.063" (1.60mm)
Circuit Pattern
Pad Per Hole (Both Sides)
Proto Board Type
Breadboard, General Purpose
Size / Dimension
2.00" L x 2.00" W (50.8mm x 50.8mm)
AttributeValue
Pitch0.1" (2.54mm) Grid
SeriesCI-Perf
PlatingPlated Through Hole (PTH)
MaterialFR4 Epoxy Glass
PackagingRetail Package
Part StatusActive
ManufacturerCorleto Industries
Edge ContactsCustom
Hole Diameter0.040" (1.02mm)
Board Thickness0.063" (1.60mm)
Circuit PatternPad Per Hole (Both Sides)
Proto Board TypeBreadboard, General Purpose
Size / Dimension2.00" L x 2.00" W (50.8mm x 50.8mm)

Purchase & Inquiry

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.